Code: 10390005 WEICON HP is a virtually shrink-free, elastic 2-component epoxy resin with great impact and high abrasion resistance. The putty epoxy resin system is a high-performance solution, especially for structural bonding. Due to its high Elongation at Break, WEICON HP is used for repairs on high-oscillation machines with sliding wear protection for bearings, raceways and pipes, as well as for coating heavily loaded pump casings. The adhesive can be used universally on almost all surfaces. Its paste-like structure makes it leak-proof and can be smoothed. Thus, it can be used on vertical surfaces and even „Above head level“. WEICON HP can be used in mechanical and plant engineering, apparatus engineering and many other areas of industry.